Research on Decorative and Integrated Thermal Insulation Board for External Wall
نویسندگان
چکیده
منابع مشابه
Parametric Investigation of Optimum Thermal Insulation Thickness for External Walls
Numerous studies have estimated the optimum thickness of thermal insulation materials used in building walls for different climate conditions. The economic parameters (inflation rate, discount rate, lifetime and energy costs), the heating/cooling loads of the building, the wall structure and the properties of the insulation material all affect the optimum insulation thickness. This study focuse...
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Insulation board is being fabricated and tested for use in developing countries. It is made at a low density, in the area of 5 to 10 pounds per cubic foot (80 to 160 kilograms per cubic meter), and has good thermal properties for an air based insulation, meaning R3 to R4 per inch (Btuin/hr-ft2-oF)-, or a conductivity of .048 to .036 W/m-K. The initial effort is to produce a straw insulation boa...
متن کاملNUMERICAL TECHNIQUES FOR DIFFERENT THERMAL INSULATION MATERIALS
The objective of this work is to predict the temperature of the different types of walls which are Ferro cement wall, reinforced cement concrete (RCC) wall and two types of cavity walls (combined RCC with Ferrocement and combined two Ferro cement walls) with the help of mathematical modeling. The property of low thermal transmission of small air gap between the constituents of combine materials...
متن کاملRetrospective Analysis of NIST Standard Reference Material 1450, Fibrous Glass Board, for Thermal Insulation Measurements
Thermal conductivity data acquired previously for the establishment of Standard Reference Material (SRM) 1450, Fibrous Glass Board, as well as subsequent renewals 1450a, 1450b, 1450c, and 1450d, are re-analyzed collectively and as individual data sets. Additional data sets for proto-1450 material lots are also included in the analysis. The data cover 36 years of activity by the National Institu...
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ژورنال
عنوان ژورنال: E3S Web of Conferences
سال: 2020
ISSN: 2267-1242
DOI: 10.1051/e3sconf/202016505013